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Product
Data Sheet
SMT's AMS 53-235D is
an active, solvent based, very low solids (less than 2.4%), halide free
and no-clean flux. It is developed in collaboration with the Gintic Institute
of Manufacturing Technology. This no-clean flux uses a proprietary mixture
of organic activators to provide the safest and widest operating window.
It gives soldered assemblies a "residueless" appearance. AMS 53-235D is
in full conformance with the ANSI-J-STD-004 Standards. |
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| Features & Advantages | Flux Application | |||||
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Halide
Free. No need for nitrogen inerted atmosphere. Clean surfaces to be bonded of oxide and tarnish. Protect cleaned surfaces from re-oxidation. Excellent soldering properties. Low solids content, no visible residue in the flux tank and conveyor fingers. No cleaning  reduces
machine maintenance. |
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SMT's
AMS 53-235D can be applied by spray, wave or foam fluxing methods. When
spray fluxing, the uniformity of the flux can be checked by first running
a piece of cardboard Over the spray fluxer. When foam fluxing, the foam
fluxer should use Compressed air free of oil and water. A uniform coating will produce the best soldering results. |
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| Application/Operating Procedures - When switching to use AMS 53-235D from another flux, the user has to ensure that the flux tank, conveyor fingers or pallets is thoroughly cleaned with a solvent or IPA. - Extra rinse is recommended by using the recommended thinner of this flux. - It is formulated for either the spray or foam method. - In the spray fluxing operation, it is important to optimise the spray equipment to achieve the right amount of flux that is evenly coated on boards. With this, optimum-soldering results can be achieved. - In the flux foaming operation, it is important to use dry air. Flux level shall be maintained at 20 mm above the foaming stone. The chimney opening shall be around 15 to 20 mm. A gentle air-knife is to be installed to ensure that excessive flux is removed. If assemblies are to be soldered on fixtures, ensure that no hot fixture is causing the deterioration in foam height. - Control of this flux is done with the titration method. - Recommended topside board temperature during pre-heat to be 80 to 90°C. - The conveyor speed, inclination angle and solder contact time are to be adjusted according to the board design, to achieve the optimum soldering result. |
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