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Product Data Sheet

WS-3310
Organic Water Soluble FLUX

The WS-3310 is developed for the present day circuit board designs and assemblies. With denser board designs resulting in space restriction, the higher conveyor speeds, wider variability in soldering of conductor surfaces and component leads; minimising costs and time in touch ups and flux removal, and complying with environmental regulations, the WS-3310 is the solution.

Its fluxing ability is much greater than that exhibited by activated rosin fluxes, resulting in reduced touch-ups. This flux shows excellent capillary action on plated through-holes allowing especially effective soldering of multi-layer boards. The low solid content also allows for faster and more efficient preheating. For after soldering, the boards can be effectively cleansed with plain water. The flux is also designed to produce a minimal amount of foaming during the cleaning operation such that problems associated with excessive foaming are eliminated.

The neutral chemistry of this organic flux, WS-3310, is the reason why it is unique; it is neither acid nor alkaline. This is the important factor that relates directly to the reliability, the high speed soldering and cleaning of printed circuit assemblies. With its good soldering properties, the WS-3310 improves overall durability and productivity. It does not attack properly cured solder masks or laminates; and will not degrade the surface insulation resistance of the soldered assembly. The assembled boards will be provided with a high ionic cleanliness with the simple cleansing and removal of flux residues with plain water without any need for additives.


Application

The WS-3310 is an organic flux, which is specifically made for use in the foam fluxing equipment. It can also be applied by dipping or wave soldering methods. Unlike the strong acid fluxes, the Ws-3310 is neutral and will not attack soldering or cleaning equipment. The formulation of Ws-3310 does not include water so there is no splattering of flux when the printed circuit assembly contacts the solder wave. Preheating the component side of a double-sided circuit board assembly to 82 - 90°C is recommended. This will evaporate the alcohol solvent portion of the flux and bring the flux to its optimum activation level. Besides, preheating of the board will also reduce the temperature gradient before the board comes in contact with the solder wave. The specific gravity of the flux must be checked at regular intervals. For the best soldering results, Solvent 330 should be added as and when appropriate to attain the correct specific gravity.

Physical Properties
Appearance and Colour Specific Gravity @ 24°C
Flash Point
Spreading Coefficient (%)
pH Value (JIS Z 3197-4-10) Melting Point
Recommended SMT Thinner

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Pale Amber
0.87 +/- 0.005
16°C
96
6.5 - 7.0
43 - 47°C
R330
 

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