For good solderbility of electroplated tin and tin-lead printed circuit boards and component leads, a tightly controlled plating anodes of the highest purity and uniformity is required.

The use of only pure virgin grade of raw materials and the strict quality control of metallic impurities to a minimum level in SMT's maunufacturing process assures far superior plating results. SMT Solder Anodes are extruded under high pressure in which a dense, fine grain structure with continuous uniformity is achieved.

With the purity and uniformity of SMT Solder Anodes, an improved anode efficiency is attained. The results will be a longer anode life, fewer chemical additions to the planting bath, better solderbility of plated parts; and an overall economy in costs.

Legend: T - Thickness, W - Width

Shape	Description	Surface Area	Perimeter	Size	Length
	Star-Shape 10pts	2469 mm²	420 mm	0 Ø 77 mm (3") 1 Ø 30 mm (1.18")	As Per Customer's Requirement
	Star-Shape 12pts	2473 mm²	480 mm	0 Ø 73 mm (2.87") 1 Ø 35mm (1.38")
	Hexagonal 14pts	1828 mm²	198 mm	T: 62 mm W: 74 mm
	Hexagonal 10pts	2473 mm²	480 mm	T: 38 mm W: 74 mm
	Octagonal Shape	2007 mm²	180.2 mm	T: 37 mm (1.46") W: 72 mm (2.84")
	Saw-Tooth Shape	1700 mm²	281.5 mm	T: 26 mm W: 84 mm (3.3")
	Round Shape	1983 mm²	157 mm	Ø: 50 mm
	Rectangular Shape	1628 mm² 2368 mm²	-	T22 x W74 mm T32 x W74 mm
	Flat Shape	950 mm²	-	T10 x W95 mm (0.4" x 3.74")

*Tin / Lead configurations and other shapes are available on request.