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Product Data Sheet

GPF 800-1
NO-CLEAN FLUX

SMT's GPF 800-1 is an active, solvent based, medium solids, halide free and no-clean flux. This no-clean flux formula uses a small percentage of rosin and non-halide activators to provide the rosin-activation giving excellent solder wetting to "protected" copper and solder coated surfaces. It also has a wide operating window. GPF 800-1 gives soldered assemblies a "residueless" appearance.

Features & Advantages		Flux Application
- - - - - - -	Halide Free. No need for nitrogen inerted atmosphere. Clean surfaces to be bonded of oxide and tarnish. Protect cleaned surfaces from re-oxidation. Excellent soldering properties. Low solids content, no visible residue in the flux tank and conveyor fingers. No cleaning reduces machine maintenance.	- - -	By spray, foam or wave method. When spray fluxing, the uniformity of the flux can be checked by first running a piece of cardboard over the spray fluxer. A uniform coating will produce the best soldering results.

Application/Operating Procedures
-	When switching to use GPF 800-1 from another flux, the user has to ensure that the flux tank, conveyor fingers or pallets is thoroughly cleaned with a solvent or IPA.
-	Extra rinse is recommended by using the recommended thinner of this flux.
-	It is formulated for either the spray, foam or wave method.
-	In the spray fluxing operation, it is important to optimise the spray equipment to achieve the right amount of flux that is evenly coated on boards. With this, optimum-soldering results can be achieved.
-	Control of this flux is done with the titration method.
-	Recommended topside board temperature during pre-heat to be 121 to 163°C (190 to 240°F).
-	The conveyor speed, inclination angle and solder contact time are to be adjusted according to the board design, to achieve the optimum soldering result.



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