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Product Data Sheet

GPF 800m-2
NO-CLEAN FLUX

SMT's GPF 800m-2 is a special Matt Finish Flux. Not only it is active, solvent based, medium solids, halide free and a no-clean flux, it also gives a matt finish to solder joints. This no-clean flux formula uses a small percentage of rosin and non-halide activators to provide the rosin-activation giving excellent solder wetting to "protected" copper and solder coated surfaces. It also has a wide operating window. GPF 800m-2 gives soldered assemblies a "residueless" appearance.

Features & Advantages		Flux Application
- - - - - - - -	Matt Finish to solder joints. Halide Free. No need for nitrogen inerted atmosphere. Clean surfaces to be bonded of oxide and tarnish. Protect cleaned surfaces from re-oxidation. Excellent soldering properties. Low solids content, no visible residue in the flux tank and conveyor fingers. No cleaning reduces machine maintenance.	- - -	By spray, foam or wave method. When spray fluxing, the uniformity of the flux can be checked by first running a piece of cardboard over the spray fluxer. A uniform coating will produce the best soldering results.








Application/Operating Procedures
-	When switching to use GPF 800m-2 from another flux, the user has to ensure that the flux tank, conveyor fingers or pallets is thoroughly cleaned with a solvent or IPA.
-	Extra rinse is recommended by using the recommended thinner of this flux.
-	It is formulated for either the spray, foam or wave method.
	In the spray fluxing operation, it is important to optimise the spray equipment to achieve the right amount of flux that is evenly coated on boards. With this, optimum-soldering results can be achieved.
-	Control of this flux is done with the titration method.
-	Recommended topside board temperature during pre-heat to be 121 to 163°C (190 to 240°F).
-	The conveyor speed, inclination angle and solder contact time are to be adjusted according to the board design, to achieve the optimum soldering result.



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